| 摘要 |
<p>A method for manufacturing a semiconductor chip package for image sensor is provided to reduce the size of the semiconductor chip package by integrating a light transmitting cover and an image sensor. A light transmitting cover(110) including a reception space having an open lower part is prepared. A first conductive line(121), a second conductive line(123), and a third conductive line(125) are formed in the light transmitting cover. A bump(131) is formed at an upper part of the reception space to be electrically connected to the third conductive line. An image sensor(151) is coupled with the bump by using a flip chip manner, to be mounted in the reception space. A sealing member(161) of a resin material is implanted into the reception space to seal the image sensor.</p> |
