发明名称 Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured
摘要 A method and an apparatus for transferring a substantially flat and substantially circular objects, such as wafers, from a pick-up position to a delivery position, the apparatus comprising, a manipulator, at least one source for emitting a source signal, at least one sensor for sensing said source signal and for providing a sensor signal, a computing device arranged for processing at least one sensor signal to obtain data on the position of said object, the manipulator being arranged for simultaneously transferring a first and a second object along a path in a substantially parallel orientation, spaced apart from each other, and substantially co-axially whereby the central axis of each object may be displaced radially, a said source and a said sensor are connected by a virtual line, whereby the virtual line includes an angle with the central axes of the first and second objects.
申请公布号 US2008319559(A1) 申请公布日期 2008.12.25
申请号 US20070821538 申请日期 2007.06.22
申请人 DE RIDDER CHRISTIANUS GERARDUS;OOSTERLAKEN THEODORUS GERARDUS 发明人 DE RIDDER CHRISTIANUS GERARDUS MARIA;OOSTERLAKEN THEODORUS GERARDUS MARIA
分类号 H01L21/67;G01V8/00;H01L21/677;H01L21/68 主分类号 H01L21/67
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