MANUFACTURING METHOD OF METAL CERAMIC CIRCUIT BOARD, METAL CERAMIC CIRCUIT BOARD, SUBSTRATE FOR CIRCUIT BOARD, AND LAMINATE FOR CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal ceramic circuit board that can be manufactured at low cost.SOLUTION: When manufacturing the metal ceramic circuit board by providing a conductor layer at a front side of a nitride ceramic substrate at least and forming a circuit pattern in the conductor layer, the manufacturing method includes: a junction layer pattern forming step for forming a junction layer pattern 3a which is formed from a metal and/or a metal alloy, has a predetermined pattern and joins a nitride ceramic substrate 1 and a conductor layer 4, on a surface 1a of the nitride ceramic substrate 1; a conductor layer forming step for joining the conductor layer on the surface 1a of the nitride ceramic substrate 1 while covering the junction layer pattern 3a and at least a portion in a location where the junction layer pattern 3a is not present, with the conductor layer 4 in a metal foil state; and a circuit pattern forming step for forming the circuit pattern in the conductor layer 4 by removing a conductor layer portion that covers the location where the junction layer pattern 3a is not present, on the surface of the nitride ceramic substrate.SELECTED DRAWING: Figure 1