发明名称 Metal smart card with dual interface capability
摘要 A dual interface smart card having a metal layer includes an IC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.
申请公布号 US9390366(B1) 申请公布日期 2016.07.12
申请号 US201514793963 申请日期 2015.07.08
申请人 COMPOSECURE, LLC 发明人 Herslow John;Lowe Adam;Dasilva Luis;Nester Brian
分类号 G06K19/06;G06K19/077;H01L25/00 主分类号 G06K19/06
代理机构 代理人 Schanzer Henry I.
主权项 1. A metal smart card with dual interface capability comprising: a metal layer of thickness D having a top surface and a bottom surface extending parallel to each other; an integrated circuit (IC) module having a top region with contacts enabling the IC module to make physical contact to a card reader and said IC module also including means for radio frequency (RF) communication with a card reader; said IC module having a length L1, a width W1 and a thickness of D1, which is less than D; a plug of non RF impeding material having lateral dimensions of L2, equal to or greater than L1, and W2 equal to or greater than W1; an opening in said metal layer extending for the full thickness of said metal layer in which is securely located said IC module mounted on said plug, said IC module and said plug extending in the vertical direction between the top and bottom surfaces of the metal layer, with the contacts of the IC module being positioned along the same horizontal plane as the top surface of the metal layer.
地址 Somerset NJ US