Method and regeneration apparatus for regenerating a plating composition

摘要

A method and apparatus for regenerating a plating composition which is suitable for depositing at least one first metal on a substrate where the plating rate in the plating composition is very low, where the concentration of the at least one first metal in the plating composition cannot be easily set at a constant level, and where plating-out of the at least one first metal from the plating composition takes place. The method and apparatus for regenerating a plating composition is suitable for depositing at least one first metal on a substrate at a sufficiently high plating rate, while offering the opportunity to easily adjust the concentration of the at least one first metal in the plating composition at a constant level and to provide the plating composition with sufficient stability against decomposition thereof in order to safeguard the regeneration cell from plated-out first metal.

主权项

1. Regeneration apparatus (300) for regenerating a plating composition which is suitable for depositing at least one first metal on a substrate (10), said regeneration apparatus (300) being especially adapted to perform a method of regenerating a plating composition which is suitable for depositing at least one first metal on a substrate (10) and which is accommodated by at least one plating device (100), said plating composition containing said at least one first metal in an ionic form and at least one second metal in an ionic form, wherein said at least one second metal may be provided in a higher and in a lower oxidation state and, when it is provided in a lower oxidation state, is capable of reducing said at least one first metal being in the ionic form to a metallic state, wherein said plating composition is accommodated by at least one plating device (100) and contains at least one first metal in an ionic form and at least one second metal in an ionic form, wherein said at least one second metal may be provided in a higher and in a lower oxidation state and, when it is provided in a lower oxidation state, is capable of reducing said at least one first metal being in the ionic form to a metallic state, said regeneration apparatus (300) comprising:
(a) at least one regeneration device (200) comprising:
i. a working electrode compartment (202) and a counter electrode compartment (203);ii. a working electrode (205) being disposed in said working electrode compartment (202) and a counter electrode (206) being disposed in said counter electrode compartment (203);iii. an ion selective membrane (204) separating said working electrode compartment (202) and said counter electrode compartment (203) from each other;iv. an electric current supply for energizing said working electrode (205) and said counter electrode (206); (b) means (250, 260, 257, 267) for removing at least part of said plating composition from said at least one plating device (100) and means (280, 285, 286) for contacting said removed plating composition with said working electrode (205); (c) at least one first holding tank (230) being adapted for accommodating a first portion of said removed composition after said first portion of said removed composition has been cathodically treated in said regeneration device (200); (d) at least one second holding tank (240) being adapted for accommodating a second portion of said removed composition after said second portion of said removed composition has been anodically treated in said regeneration device (200); and (e) means (250, 260, 235, 245) for returning said first and second portions to said at least one plating device (100),
wherein said at least one first holding tank (230) and said at least one second holding tank (240) are in fluid connection with said at least one regeneration device (200).