| 摘要 |
A die ejector comprises a base plate (1) having a slot (2) and a table plate (3), which is situated on the base plate (1). The table plate (3) has a slot (4) which runs parallel to the slot (2) of the base plate (1) and is adapted to the width of the semiconductor chips to be detached from a foil. A channel (8), to which vacuum can be applied opens into the slot (2) of the base plate (1) or the slot (4) of the table plate (3). Two deflection rollers (9, 10) are situated below the base plate (1) at opposite ends of the slot (2) of the base plate (1). A drive belt (11), which is wider than the slot (2) of the base plate (1) and which is guided around the two deflection rollers (9, 10), seals the slot (2) of the base plate (1). A slide (13) is situated in the slot (2) of the base plate (1) and is fastened on the drive belt (11). A motor (12) moves the drive belt (11) back and forth. A slide plate (14), whose width is equal to the width of the slot (4) of the table plate (3), is removably fastenable on the slide (13). |
