| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion of jointed composite wafer 7 in a wafer joint device 10 for jointing a plurality of wafers 1.SOLUTION: A wafer joint device 10 has a wafer positioning part 80 for regulating a vertical position coordinate of the wafer 1 with the wafer 1 erected vertically, a pressing part 60 for pressing a plurality of wafers 1 by moving the plurality of wafer in a horizontal direction perpendicular to a principal plane of the wafer 1, and a vacuum mechanism 90 for making the wafer positioning part 80 and the pressing part 60 in a vacuum state. Dust or the like can be inhibited from being adhered to the wafer 1 by jointing the wafer 1 in a vertically supported state, which enhances the adhesion of the jointed composite wafer 7. |
