| 摘要 |
PROBLEM TO BE SOLVED: To suppress stress caused by warpage of a mounting substrate from being propagated to an element, in an electronic component mounting the element on the mounting substrate.SOLUTION: A sensor unit 11 as an electronic component comprises: a mounting substrate 17 provided with a connection terminal 73 as a first terminal, on a first surface 17a; and an acceleration sensor 18 as an element that has a mounting surface, and a terminal surface 18a that has a front and back relationship with the mounting surface and that is provided with an output terminal 23 as a second terminal. With respect to the acceleration sensor 18, the mounting surface and the first surface 17a are bonded with each other via a junction material, and the connection terminal 73 and the output terminal 23 are connected with each other via a bonding wire 98 as a conductive member. A groove part 50 is provided in a region including a region overlapped with the acceleration sensor 18 of the mounting substrate 17, in a plan view.SELECTED DRAWING: Figure 3 |
