WAFER PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To efficiently obtain a chip of stable quality.SOLUTION: A wafer processing method for cutting a wafer inside which a modified area is formed with laser light includes: grinding means of grinding a back surface of the wafer and removing the modified area while leaving micro cracks extended from the modified area; and polishing means of polishing the back surface of the wafer after the grinding.SELECTED DRAWING: Figure 14