| 摘要 |
Described is a transfer film, in particular a hot embossing film, which includes a carrier film and a transfer layer portion having a structure layer, the transfer layer portion being arranged on the carrier film and being detachable from the carrier film, wherein it is provided that the carrier film has a master relief structure on its side towards the structure layer and the structure layer on its side towards the carrier film has a relief structure complementary to the master relief structure of the carrier film. There is further provided a process for the production of the transfer film and a multi-layer body formed with the structure layer. |
