| 摘要 |
The invention concerns a solvent-type adhesive for assembling non-porous thermoplastic piping elements, obtained from a polymer resin dissolved in one or several organic solvent(s) and optionally comprising fillers, thickening, colouring, stabilising, masking agents, said adhesive comprising at least a solid additive at a temperature less than 45 DEG C, soluble or dispersible in solvents, said additive being capable of constituting a barrier-forming film on the adhesive surfaces exposed to the open air and quickly countering emission of solvents or other volatile organic compounds. The invention is characterised in that the amount of additive introduced in the adhesive is such that it represents less than 20 % of the amount of additive required to produce saturation of the adhesive solvents. The invention is useful for assembling non-porous thermoplastic piping elements.
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