| 摘要 |
A surface acoustic wave device substantially eliminates a stress caused by a curing shrinkage of an adhesive (8) and substantially eliminates a strain in a case (2) containing a surface acoustic wave element (3) to prevent variation in characteristics of the surface acoustic wave device. In addition, a strength of joining of bonding wires (14, 15) provided in the surface acoustic wave device is improved to have an improved reliability. The surface acoustic wave element (3) of the surface acoustic wave device is fixed on a case member (4) via a soft adhesive (8) and bonding electrodes (9a, 9b) of the surface acoustic wave element have a plurality of through holes (11). Ends of the bonding wires (14, 15) are wire-bonded to the bonding electrodes (9a, 9b) having the through holes (11) formed therein. <IMAGE> |
