| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor, exhibiting high adhesion to a semiconductor member and excellent releasability in molding and capable of increasing reliability of a semiconductor, and a semiconductor device of high reliability sealed with the epoxy resin composition. SOLUTION: This epoxy resin composition for sealing a semiconductor comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C), an amide compound (D) and an organopolysiloxane (E), wherein the content of the inorganic filler (C) is 50-95 wt.%, the amide compound (D) is the one comprising an 8-22C fatty acid and is contained in an amount of 0.01-2 wt.% in the composition, and the organopolysiloxane (E) is an epoxy group-containing organopolysiloxane obtained by reacting a carboxyl group-containing organopolysiloxane with an epoxy compound and is contained in an amount of 0.01-2 wt.% in the composition.
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