发明名称 LOW HYGROSCOPIC POLYIMIDE AND POLYAMIC ACID SOLUTION
摘要 PROBLEM TO BE SOLVED: To obtain the subject polyimide containing a specific recurring unit as a component, having good mechanical physical properties and heat resistance, and a low hygroscopic rate, and useful for a coating film, s film, etc. SOLUTION: This low hygroscopic polyimide containing a recurring unit of the formula [(n) is an integer] as a component, is preferably obtained by polymerizing a biphenyltetracarboxylic acid such as 3,3',4,4'- biphenyltetracarboxylic acid dianhydride with 4,4'-bis(4-aminophenoxy)biphenyl in an organic polar solvent (e.g.; N-methyl-2-pyrrolidone) preferably at 5-50 deg.C to obtain a polyamic acid solution, applying the polyamic acid solution containing preferably 5-50 wt.% polyamic acid on a supporting body or a substrate, heating and drying for imide formation. The polyamic acid solution has preferably 1.05-0.95 molar ratio of the tetracarboxylic acid dianhydride to the diamine. Also, it is preferable to add an imide forming catalyst to the polyamic acid solution.
申请公布号 JP2000044682(A) 申请公布日期 2000.02.15
申请号 JP19980216894 申请日期 1998.07.31
申请人 UBE IND LTD 发明人 YAMAMOTO TOMOHIKO;MURAKAMI TORU;YAMAGUCHI HIROAKI
分类号 C08G73/10;C08L79/08;(IPC1-7):C08G73/10 主分类号 C08G73/10
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