发明名称 |
Composition and process for forming electrically insulating thin films |
摘要 |
To provide a composition and process for forming insulating films that can produce insulating films having low dielectric constants. The composition comprises (A) an electrically insulating curable inorganic or organic resin, (B) a solvent, and (C) at least one solvent-soluble substance (excluding the solvent used for component (B)) that upon heating or by interaction with the resin (A) can generate gas or undergo volatilization in the temperature range from 0 DEG C. to 800 DEG C. The insulating films are prepared by coating the surface of a substrate the composition; evaporating the solvent; and subsequently heating the substrate in order to generate gas from component (C) during the course of or after the cure of the said resin (A).
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申请公布号 |
US6149966(A) |
申请公布日期 |
2000.11.21 |
申请号 |
US19980120384 |
申请日期 |
1998.03.31 |
申请人 |
DOW CORNING TORAY SILICONE CO., LTD. |
发明人 |
KOBAYASHI, AKIHIKO;MINE, KATSUTOSHI;NAKAMURA, TAKASHI;SASAKI, MOTOSHI;SAWA, KIYOTAKA |
分类号 |
C09D5/25;C09D7/12;C09D125/02;C09D127/12;C09D129/10;C09D179/08;C09D183/04;C09D183/05;C09D201/00;H01B3/30;H01B3/42;H01B3/46;H01L21/312;H01L21/316;(IPC1-7):B05D3/02;B05D5/12 |
主分类号 |
C09D5/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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