PRODUCTION OF POSITIONING JIG FOR SEMICONDUCTOR WAFER, PRODUCTION OF THE SAME AND LAMINATING DEVICE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a method for producing the positioning jig for a semicon ductor wafer in which positioning efficiency is effectively enhanced for laminat ing the semiconductor wafer and to provide a method for producing the semicon ductor wafer and a laminating device of the same. SOLUTION: A plurality of semiconductor wafers are laminated and placed on a carbon slice plate 36 and this laminated state is held by a clamp base 24. A positioning jig 22 formed of a wire saw is placed on the upper part of the laminated semiconductor wafers and the laminated state is inspected by using a camera 26.