| 摘要 |
A ball supply apparatus of a ball mounter for a semiconductor package is provided to simplify structure and operation of the apparatus by supplying the exact number of balls to a ball transfer box and immediately transferring the supplied balls to a tray. A ball supply apparatus of a ball mounter for a semiconductor package includes a ball supply unit, a ball transfer box(20), an electronic scale(30), a rotating unit, and a tray(50). The ball supply unit supplies balls. The ball transfer box is installed to rotate up and down with respect to a rotation axis(21) and supplied with the balls from the ball supply unit. The electronic scale is installed under the ball transfer box to measure weight of the balls supplied to the ball transfer box. The rotating unit rotates the ball transfer box up and down when the weight of the balls measured by the electronic scale reaches a predetermined value. The tray is supplied with the balls discharged from the ball transfer box by rotation of the ball transfer box.
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