PRINTED CIRCUIT BOARD AND THE METHOD OF MANUFACTURING THEREOF

摘要

A PCB(Printed Circuit Board) and a method of manufacturing the same are provided to improve coupling strength between bumps by coupling the bumps formed on top and bottom surfaces through engagement. A method of manufacturing a PCB includes the steps of: preparing a first bump layer having a first bump(S11); preparing a second bump layer having a second bump and a receiving groove to insert the first bump(S12); and inserting the first bump into the receiving groove through compression after arranging the first and second bump layers on both surfaces of an insulating layer respectively(S15). The step includes the step of forming holes corresponding to the first and second bumps on the insulating layer(S13).