| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card for a wafer test capable of coping with various integrated circuit chips. SOLUTION: This probe card 301 is equipped with a main card 311 having a flat board having a hole formed on the center, auxiliary cards 401, 402 mounted vertically on the main card 311 through the hole, and a plurality of probe needles attached to the auxiliary cards 401, 402. In the probe card 301, the auxiliary cards 401, 402 can be mounted on/dismounted from the main card 311. Hereby, the probe card 301 can be used by replacing only the auxiliary cards 401, 402 according to the kind of the integrated circuit chip. Each of the auxiliary cards 401, 402 has a simple structure, low manufacturing cost, and a short manufacturing period. Consequently, the manufacturing cost of the probe card 301 can be reduced greatly, and the manufacturing period can be shortened greatly. COPYRIGHT: (C)2008,JPO&INPIT
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