| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation sheet, a wiring board and a mounting structure, capable of improving bonding force between inorganic insulating particles.SOLUTION: Disclosed is an insulation sheet 1 which includes a sheet member 2 and a first insulation layer 4 arranged on the sheet member 2. The first insulation layer 4 includes: a plurality of inorganic insulation particles 6 whose parts are bonded to each other; and a first resin part 8 arranged between the plurality of inorganic insulation particles 6. The plurality of inorganic insulation particles 6 includes a first inorganic insulation particle 11 whose diameter is 5-80 nm, and a second inorganic insulation particle 12 whose diameter is 0.1-5 μm and have a functional group on the surface of the first inorganic insulation particle 11 and on the surface of the second inorganic insulation particle 12.SELECTED DRAWING: Figure 3 |
