发明名称 |
DICING SHEET, DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
Provided is a dicing sheet and a dicing/die-bonding film with which it is possible to eliminate sagging of the dicing sheet and to prevent contact between semiconductor elements. The present invention relates to a dicing sheet that contracts as a result of being heated for 1 minute at 100°C, with a second length in the MD direction after heating being 95% or less of 100% of a first length in the MD direction before heating. The dicing sheet is provided with a substrate, and a pressure-sensitive adhesive layer disposed on the substrate. The dicing/die-bonding film is provided with the dicing sheet, and an adhesive layer disposed on the pressure-sensitive adhesive layer. |
申请公布号 |
WO2016093308(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
WO2015JP84644 |
申请日期 |
2015.12.10 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
SHISHIDO, YUICHIRO;MISUMI, SADAHITO;ONISHI, KENJI;YANAGI, YUICHIRO |
分类号 |
H01L21/301;C09J7/02;H01L21/52 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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