| 发明名称 |
ELECTRICALLY INTERCONNECTING FOIL |
| 摘要 |
The invention relates to a bendable electrically interconnecting foil for making flexible electronic circuits, more in particular circuits comprising rigid electronic components such as integrated circuits. The foil comprises a flexible substrate and stretchable conductive tracks for connecting the electronic components. Between the substrate and the tracks a resilient layer is situated. The invention further relates to an electronic circuit comprising the bendable electrically interconnecting foil. |
| 申请公布号 |
US2016211473(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201414916610 |
申请日期 |
2014.09.04 |
| 申请人 |
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO ;IMEC vzw |
发明人 |
VAN DEN ENDE Daan Anton;KUSTERS Roel Henry Louis;VAN DEN BRAND Jeroen |
| 分类号 |
H01L51/00;H05K1/03;H01L51/42;H05K1/02;H01L51/50;H01L51/05 |
主分类号 |
H01L51/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Electrically interconnecting foil comprising:
a flexible substrate made of a substrate material and a stretchable electrically conductive track, and a resilient layer situated between the substrate and the track, mechanically connecting the track and the substrate, said resilient layer having a Young's modulus which is lower than the Young's modulus of the substrate material. |
| 地址 |
's-Gravenhage NL |
