| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive heat dissipation film which can dissipate heat generated from an electronic component or the like, in a small electronic apparatus efficiently.SOLUTION: A heat dissipation film consists of a heat transfer layer 11 containing graphene fine grain and a binder resin, and a plastic film 12 bonded to at least one side of the heat transfer layer 11. Thickness of the heat transfer layer 11 is 30-250 g/m(represented by the weight of graphene fine grain per 1 m), the mass ratio of binder resin and graphene fine grain in the heat transfer layer 11 is 0.001-0.1, and the graphene fine grain is oriented substantially in parallel with the plastic film 12. |
