| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a device chip capable of continuously arranging a plurality of devices side by side in one line without a gap.SOLUTION: The manufacturing method includes: a modified layer formation step for forming a plurality of two lines of modified layers 21 that are in parallel with each other, in a vertical direction by positioning a convergence point P of a laser beam of a wavelength having transmissivity with respect to a semiconductor wafer 11 within the semiconductor wafer and radiating the laser beam from a rear face of the semiconductor wafer along both edges of a predetermined dividing line 13a in a width direction; and a division step for dividing the semiconductor wafer into a plurality of device chips with the modified layer as a fracture starting point by applying an external force to the semiconductor wafer after the modified layer formation step is implemented. In the modified layer formation step, the rear-side modified layer is formed at a position displaced from the front-side modified layer closer to a device 15, and a side face of the device chips fractured along the plurality of modified layers protrudes most at the front side.SELECTED DRAWING: Figure 5 |
