发明名称 ABOVE MOTHERBOARD INTERPOSER WITH QUARTER WAVELENGTH ELECTRICAL PATHS
摘要 An apparatus includes a processor having an array of processor interconnects arranged to connect the processor to conductive paths, a circuit substrate having an array of circuit interconnects arranged to provide connections between the processor and the circuit substrate, the circuit substrate having conductive paths connected to the array of circuit interconnects, an interposer substrate arranged between the processor and the circuit substrate, at least one conductive trace in the interposer substrate in connection with at least one processor interconnect in the array of interconnects on the processor, the conductive trace arranged at least partially parallel to the interposer substrate such that no electrical connection exists between the conductive trace in the interposer substrate and a corresponding one of the circuit interconnects on the circuit substrate, and at least one peripheral circuit connected to the at least one conductive trace
申请公布号 US2016259738(A1) 申请公布日期 2016.09.08
申请号 US201615156211 申请日期 2016.05.16
申请人 MORGAN / WEISS TECHNOLOGIES INC. 发明人 Johnson Morgan;Weiss Frederick G.
分类号 G06F13/16;H05K1/18;G06F13/40;H01L23/498;G11C5/04;H05K1/14;H05K1/11;H05K1/02 主分类号 G06F13/16
代理机构 代理人
主权项 1. An apparatus comprising: a processor having an array of processor interconnects arranged to connect the processor to conductive paths; a circuit substrate having an array of circuit interconnects arranged to provide connections between the processor and the circuit substrate, the circuit substrate having conductive paths connected to the array of circuit interconnects; an interposer substrate arranged between the processor and the circuit substrate, at least one conductive trace in the interposer substrate in connection with at least one processor interconnect in the array of interconnects on the processor, the conductive trace arranged at least partially parallel to the interposer substrate such that no electrical connection exists between the conductive trace in the interposer substrate and a corresponding one of the circuit interconnects on the circuit substrate; and at least one peripheral circuit connected to the at least one conductive trace, wherein signals travel through the trace between the processor and the peripheral circuit in 100 picoseconds or less.
地址 Beaverton OR US