| 主权项 |
1. A method of forming an LED package, comprising:
forming a plurality of integrated circuit LEDs with LED connection terminals as part of a first semiconductor substrate; providing a second semiconductor substrate having a first face and second face opposite the first face; forming a plurality of switching transistors on the first face; forming through vias extending between the first face and the second face; forming package terminals on the second face; bonding the first semiconductor substrate and the first face of the second semiconductor substrates together, wherein each integrated circuit LED is positioned over a corresponding switching transistor, thereby making electrical connection between the integrated circuit LED and the corresponding switching transistor; and dicing the bonded first and second semiconductor substrates to form individual LED packages or groups of LED packages, wherein:
each LED package has an integrated circuit LED, two LED connection terminals, a switch transistor, and three package terminals;the three package terminals are coupled to the switching transistor's source or drain, the switching transistor's gate, and one of the two LED connection terminals;at least one through via in the second semiconductor substrate that couples one of the three package terminals to one of the two LED connection terminals, andthe switching transistor is electrically connected in series with the LED. |
