Integrated heat spreader for multi-chip packages

摘要

An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.

主权项

1. A microelectronic structure, comprising:
a microelectronic substrate; a multi-chip package electrically connected to the microelectronic substrate, wherein the multi-chip packing includes a plurality of microelectronic devices disposed thereon; and an integrated heat spreader attached to the microelectronic substrate, comprising:
a heat spreader frame having a plurality of openings extending from a first surface of the heat spreader frame to a second surface of the heat spreader frame, wherein the plurality of openings each define at least one opening sidewall extending between the heat spreader frame first surface and the heat spreader frame second surface;a plurality of thermally conductive structures, each having a first surface, an opposing second surface, a least one sidewall extending between the thermally conductive structure first surface and the thermally conductive structure second surface, wherein each of the plurality of thermally conductive structures are secured within a corresponding plurality of openings with the at least one thermally conductive structure sidewall abutting its corresponding at least one heat spreader frame sidewall, wherein the second surface of each of the plurality of thermally conductive structures is in thermal contact with a corresponding microelectronic device of the multi-chip package, and wherein the first surface of each of the plurality of thermally conductive structures are substantially planar to the heat spreader frame first surface; andwherein the heat spreader frame has a thickness defined between the heat spreader frame first surface and the heat spreader frame second surface; wherein each thermally conductive structure has a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface; and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of the heat spreader frame.