Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims

摘要

The long sides of a rectangular control chip and the long sides of a rectangular memory chip are arranged parallel with first sides of the upper surface of a wiring substrate in a BGA. A lid includes a pair of first brims and a pair of second brims, the widths of the second brims are formed wider than those of the first brims, and a mounting area for mounting chip parts and a junction base area for joining the lid are secured outside the short sides of the control chip mounted on the upper surface of the wiring substrate and outside the short sides of the memory chip mounted on the upper surface of the wiring substrate, which enables the wide-width second brims of the lid to be disposed on the junction base area. Hence, the mounting area of the BGA can be reduced.

主权项

1. A semiconductor device comprising:
a first semiconductor chip including a first main surface and a first rear surface opposite to the first main surface, the first main surface being formed in a rectangular shape; a second semiconductor chip including a second main surface and a second rear surface opposite to the second main surface, the second main surface being formed in a rectangular shape; a wiring substrate including a first surface and a second surface opposite to the first surface, the first and second semiconductor chips being respectively flip-chip mounted on the first surface via a plurality of protruding electrodes, the first surface being formed in a quadrangular shape having a pair of first sides which are arranged opposite to each other and a pair of second sides which are arranged opposite to each other; a cover member being disposed on the first surface of the wiring substrate and covering the first and second semiconductor chips, the cover member being secured along the second sides of the first surface of the wiring substrate, wherein the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are respectively arranged opposite to the first surface of the wiring substrate, wherein long sides of the first main surface of the first semiconductor chip and the long sides of the second main surface of the second semiconductor chip are arranged substantially parallel with the first sides of the first surface of the wiring substrate, wherein the cover member includes a pair of first brims respectively arranged along the first sides of the first surface of the wiring substrate and a pair of second brims respectively arranged along the second sides of the first surface of the wiring substrate, and wherein the widths of the second brims are wider than the widths of the first brims, and wherein a marking is placed in one of four corner portions which is not covered with the cover member on the first surface of the wiring substrate.