发明名称 Integrated inductor device with high inductance in a radiofrequency identification system
摘要 An embodiment of integrated inductor device, comprising a plurality of modules overlaid to each other, each module including at least one coil of conducting material. The directly overlaid pairs of coils are coiled in opposite directions. The directly overlaid modules are mechanically coupled through first adhesive conductive regions and the coils of the directly overlaid modules are electrically coupled to each other through second adhesive conductive regions. The first and the second adhesive conductive regions coupling directly overlaid modules are formed in the same step of the process, are of the same material and are arranged at a same level.
申请公布号 US9460841(B2) 申请公布日期 2016.10.04
申请号 US201213437843 申请日期 2012.04.02
申请人 STMICROELECTRONICS S.R.L. 发明人 Fontana Fulvio Vittorio;Graziosi Giovanni
分类号 H01F5/00;H01F27/28;H01F27/24;H01F17/00 主分类号 H01F5/00
代理机构 Seed IP Law Group PLLC 代理人 Seed IP Law Group PLLC
主权项 1. An article, comprising: a plurality of modules, each module comprising, a first conductive coil that has an outer end and an inner end and that spirals in a direction from the outer end to the inner end; anda second conductive coil that is disposed over the first coil, has an outer end and an inner end, and spirals in the direction from the inner end to the outer end, one of the outer and inner ends of the second coil electrically coupled to a respective one of the outer and inner ends of the first coil;at least one first adhesive conductive region, each first adhesive conductive region being formed on an upper surface or a lower surface of the module to mechanically interconnect the module to at least one other module and being electrically isolated from the first and second conductive coils of the module; andat least one second adhesive conductive region formed on at least one of the upper and lower surfaces, each second adhesive conductive region being positioned to electrically interconnect the module to at least one other module.
地址 Agrate Brianza IT