| 摘要 |
PROBLEM TO BE SOLVED: To provide: an underfill material which is applied to a pre-coating method, enables the shortening of a curing time, produces fewer voids, and is superior in adhesiveness with an electronic component; a method for manufacturing an electronic component device, which enables the manufacturing of an electronic component device superior in connection reliability by use of such an underfill material; and an electronic component device which is superior in connection reliability and fewer in voids produced.SOLUTION: An underfill material is used in an electronic component device manufacturing method for manufacturing an electronic component device by electrically connecting an electronic component with a wiring board. The method comprises: an application step for applying the underfill material to at least one of a face of the electronic component on the side where the electronic component fronts a wiring board, and a face of the wiring board on the side where the wiring board fronts the electronic component; and a connection step for connecting the electronic component with the wiring board through a connection part and then, curing the underfill material. The underfill material comprises (A) a compound having an ethylene unsaturated double bond, (B) a reaction initiator, (C) an inorganic filler and (D) an ion-trap agent.SELECTED DRAWING: Figure 1 |
