发明名称 |
Preparation method of crystalline silicon film based on layer transfer |
摘要 |
Provided is a preparation method of a crystalline silicon film. The method includes: 1) forming a mask for making a periodic silicon rod array on a monocrystalline silicon wafer substrate, and forming the periodic silicon rod array on the monocrystalline silicon substrate by a wet chemical etching or dry etching process; 2) forming barrier layers both on the surface of the monocrystalline silicon substrate and the surface of the silicon rod array for next selectively epitaxial growth of silicon; 3) exposing silicon cores on the heads of the rod array by a selective etching process to form a protruded silicon seeds out of the mother wafer substrate; 4) growing a continuous silicon film at the top of the rod array by a selective epitaxial chemical vapor deposition method using the exposed silicon cores as protruded seeds while leaving voids between the film and the mother wafer substrate; and 5) lifting off the silicon film and transferring the silicon film to a preset substrate, and the seeded substrate is reusable. |
申请公布号 |
US9502240(B2) |
申请公布日期 |
2016.11.22 |
申请号 |
US201414890081 |
申请日期 |
2014.05.07 |
申请人 |
SHANGHAI ADVANCED RESEARCH INSTITUTE, CHINESE ACADEMY OF SCIENCES |
发明人 |
Liu Dongfang;Zhang Wei;Chen Xiaoyuan;Yang Hui;Wang Cong;Lu Linfeng |
分类号 |
H01L21/44;H01L21/02;H01L21/306;H01L21/3065;H01L31/18 |
主分类号 |
H01L21/44 |
代理机构 |
Novick, Kim & Lee, LLC |
代理人 |
Novick, Kim & Lee, LLC ;Xue Allen |
主权项 |
1. A preparation method of a crystalline silicon film based on layer transfer, comprising:
1) providing a mask on a monocrystalline silicon wafer substrate to make a periodic silicon rod array on the monocrystalline silicon substrate by a wet chemical etching process or a dry etching process; 2) forming a barrier layer on the surface of the monocrystalline silicon substrate and the surface of the silicon rods for later performing selectively epitaxial silicon growth; 3) removing the barrier layer on the heads of the rod array by a selective etching process and exposing the silicon cores on the heads of the rod array to form protruded silicon seeds; 4) growing a continuous silicon film at the top of the rod array by a chemical vapor deposition method using the exposed silicon cores as protruded seeds for selectively epitaxial growth of silicon; and 5) lifting off the silicon film and transferring the silicon film to a preset substrate. |
地址 |
Shanghai CN |