Environmental sensitive electronic device package and manufacturing method thereof

摘要

An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

主权项

1. An environmental sensitive electronic device package comprising:
a first substrate; an environmental sensitive electronic device located on the first substrate; a first adhesive located on the first substrate; a side wall barrier structure located on the first adhesive and adhered to the first substrate through the first adhesive; a second adhesive located on the side wall barrier structure; and a second substrate, the side wall barrier structure being adhered to the second substrate through the second adhesive, wherein the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate, the side wall barrier and the first substrate are spaced apart by the first adhesive, the side wall barrier and the second substrate are spaced apart by the second adhesive, the first adhesive and the second adhesive are in contact with each other, and the first adhesive or the second adhesive covers the side wall barrier structure and the environmental sensitive electronic device; wherein the side wall barrier structure surrounds the environmental sensitive electronic device.