OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICONDUCTORS

摘要

PROBLEM TO BE SOLVED: To provide a flexible interconnect structure for connecting an array of light emitting semiconductor chips.SOLUTION: An LES device 10 is provided which includes a heatsink 14 and an array of LES chips 12 mounted on the heatsink and electrically connected thereto, with each LES chip comprising a connection pad and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure 18 positioned on and electrically connected to each LES chip in order to provide for controlled operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure that is formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips.SELECTED DRAWING: Figure 1