Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly

摘要

A semiconductor integrated circuit package incorporating a preformed one-piece mold cap and heatspreader assembly is disclosed. One implementation includes a substrate with a die attached to the substrate. The die is electrically connected with electrical connections formed on the substrate using bonding wires. A preformed one-piece integrated mold cap and heatspreader assembly attached to the substrate to enclose at least a portion of the bonding wires and the die. Methods of assembling semiconductor integrated circuit packages using a preformed one-piece integrated mold cap and heatspreader assembly are also disclosed.