MANUFACTURE OF CONDUCTIVE WAFER AND CERAMICS BOARD FOR THIN PLATE SINTERED BODY AND THIN FILM MAGNETIC HEAD AND WORKING OF CONDUCTIVE WAFER

摘要

PROBLEM TO BE SOLVED: To manufacture a flat board having little camber for a thin film magnetic head with high production efficiency. SOLUTION: A conductive sintered body 10 having little camber and substantially parallel two faces is formed by calcination of raw material, and thereafter the conductive sintered body 10 is sliced along a face nearly parallel to the two faces of the conductive sintered body 10 by wire electrical discharge machining, and two or more ceramics sintered bodies 10a, 10b for a thin film magnetic head are separated by cutting from the conductive sintered body 10. The surfaces of the ceramics sintered bodies 10a 10b are polished only during a comparatively short period, thereby obtains a board thickness of 1.2 mm or less.