| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing apparatus and a dicing method in which a good dicing process can be performed for a wafer adhered to an adhesive sheet. SOLUTION: An ultra-low temperature cooling apparatus 20 is provided near grinding liquid nozzles 14, 15 of the dicing apparatus 10 to cool a grinding liquid by supplying a gas of 0°C or lower to the grinding liquid. Consequently, the clogging of a blade 12 is prevented by cooling and hardening the sheet material and the adhesive material of the adhesive sheet S with the cooled grinding liquid. Moreover, a rise in the cost of dicing equipment can be controlled by utilizing, in the ultra-low temperature cooling apparatus 20, a cooled gas generator for separating compressed gas into cooled gas and hot gas. COPYRIGHT: (C)2005,JPO&NCIPI |
