| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface processing method of wiring board which can obtain a higher bonding strength by improving wettability of electrode portion and uses a solder leveler not including lead, also to provide a wiring board and the wiring board for mounting electronic components provided with such solder leveler, and to provide a precipitation type solder composition to form the solder leveler. SOLUTION: In the surface processing method of the wiring board, the wiring board surface is coated with a precipitation type solder composition including tin powder and a salt of metal (however, lead is excluded) having the ionization trend which is lower than that of tin, and the lead-free solder leveler is formed on the surface of the wiring board by heating the coating. The circuit board is subjected to the surface process at least in the electrode portion with the lead-free solder leveler based on the surface processing method. Moreover, in the circuit board for mounting electronic component having excellent durability, the electronic components are mounted using the solder at the electrode portion having been subjected to the surface process with the lead-free solder leveler by the method explained above. COPYRIGHT: (C)2005,JPO&NCIPI |
