发明名称 |
METHOD FOR MANUFACTURING CHIP PTC THERMISTER |
摘要 |
<p>A method of manufacturing a chip PTC thermister comprises a piece of conductive polymer having a PTC characteristic and metal foils formed by patterning and provided on the upper and the lower sides of the piece under pressure integrally into a sheet, making a hole part in the sheet, applying a protective coat serving as plating resist to upper and lower sides of the sheet , forming an electrode on the by electroplating, and cutting the sheet into a chip. The protective coat is made of a material applicable at a temperature equal to or lower than the melting point of the conductive polymer. The processing temperatures at the step from the step of making a hole part in the sheet to the pre-processing step of the step of forming an electrode by electroplating on the sheet are not above the melting point of the conductive polymer. <IMAGE></p> |
申请公布号 |
EP1030316(B1) |
申请公布日期 |
2007.05.02 |
申请号 |
EP19990929725 |
申请日期 |
1999.07.07 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
IKEDA, TAKASHI;IKEUCHI, KIYOSHI;MORIMOTO, KOICHI;KOJIMA, JUNJI |
分类号 |
H01C7/02;H01C1/14;H01C17/00;H01C17/02 |
主分类号 |
H01C7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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