发明名称 |
METHOD FOR MANUFACTURING WIRING SUBSTRATE |
摘要 |
A method for manufacturing a wiring substrate by an electroless plating method that precipitates metal without using a plating resist is provided. The method includes the steps of: (a) providing a catalyst layer having a predetermined pattern on a substrate; (b) dipping the substrate in an electroless plating solution to thereby precipitate metal on the catalyst layer to provide a first metal layer; (c) exposing a top surface of the substrate to steam; and (d) dipping the substrate in an electroless plating solution to thereby precipitate metal on the first metal layer to provide a second metal layer.
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申请公布号 |
US2007218191(A1) |
申请公布日期 |
2007.09.20 |
申请号 |
US20070680846 |
申请日期 |
2007.03.01 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
FURIHATA HIDEMICHI;KIMURA SATOSHI;KANEDA TOSHIHIKO;KIJIMA TAKESHI |
分类号 |
B05D5/12 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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