Power Semiconductor Devices Having Integrated Inductor

摘要

An electronic device ( 100 ) with one or more semiconductor chips ( 102 ) has an inductor ( 101 ) assembled on or under the chips. The inductor includes a ferromagnetic body ( 111 ) and a wire ( 104 ) wrapped around the body to form at least a portion of a loop; the wire ends ( 104 a) are connected to the chips. The assembly is attached to a substrate ( 103 ), which may be a leadframe. The device may be encapsulated in molding compound ( 140 ) so that the inductor can double as a heat spreader ( 111 c), enhancing the thermal device characteristics.