| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To simplify the shape of a mold and reduce the cost of an integrated circuit element by adopting a planar base plate so as to solve a problem in which the integrated circuit element is expensive because a mold having a complicated shape for avoiding terminal pins is required in forming a resin package included in the integrated circuit element. <P>SOLUTION: The integrated circuit element 30 is provided with the planar base plate 15 having a plurality of through holes 18, a functional component 13, a plurality of terminal pins 14 conducting to the functional component 13 and passing through the respective through holes 18, and the resin package 11 formed on one surface of a base plate 15 so as to cover the functional component 13. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
