发明名称 マイクロフォンパッケージ
摘要 According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.
申请公布号 JP5951454(B2) 申请公布日期 2016.07.13
申请号 JP20120254357 申请日期 2012.11.20
申请人 株式会社東芝 发明人 東 祥弘;藤 慶彦;原 通子;湯澤 亜希子;加治 志織;永田 友彦;堀 昭男;福澤 英明
分类号 H04R15/00;H01F27/36;H01L41/06;H01L41/08;H01L41/12;H01L41/20;H01L43/02;H01L43/08;H04R1/00;H04R1/02;H04R1/04 主分类号 H04R15/00
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