Semiconductor device and method for manufacturing thereof

摘要

The present invention provides a semiconductor device including: a semiconductor chip; a lead frame provided with a recessed portion on at least one of an upper surface or a lower surface thereof, and electrically coupled to the semiconductor chip; and a resin section that molds the semiconductor chip and the lead frame, and is provided with an opening above the recessed portion. By inserting a conductive pin (not shown) into the recessed portion through the opening, a plurality of semiconductor devices can be mechanically and electrically coupled to each other.

主权项

1. A semiconductor device comprising:
a semiconductor chip; a lead frame, electrically coupled to the semiconductor chip, the lead frame provided with a recessed portion on a surface of the lead frame, wherein a hole is provided in a part of the recessed portion; and a resin section that molds the semiconductor chip and the lead frame, the resin section provided with an opening above the recessed portion of the lead frame, wherein the opening and the recessed portion comprise wholly unfilled space defined by sidewalls in the resin section and sidewalls in the recessed portion respectively that surround without contacting a conductive pin wherein the hole and the recessed portion are in the lead frame, and the opening is in the resin section, wherein from a plan perspective the opening and the recessed portion are rectangular in shape and the hole is circular in shape wherein the opening has the greatest width and the hole the smallest width.