SUBSTRATE PROCESSING APPARATUS

摘要

An upper spin chuck and a lower spin chuck are arranged in a vertical direction. In the lower spin chuck, a substrate holder sucks a center portion of a lower surface of a substrate, so that the substrate is held. In this state, a peripheral portion of the lower surface of the substrate rotated by a spin motor is cleaned by a brush of a first back surface cleaning mechanism. In the upper spin chuck, a plurality of chuck pins abut against an outer peripheral end of the substrate, so that the substrate is held. In this state, a region inward of the peripheral portion of the lower surface of the substrate rotated by the spin motor is cleaned by a brush of a second back surface cleaning mechanism. Receiving and transferring of the substrate are performed by a receiving transferring mechanism between the upper and the lower spin chucks.

主权项

1. A substrate processing apparatus comprising:
a first substrate holding device; a second substrate holding device provided directly upward of the first substrate holding device; a receiving transferring mechanism that receives and transfers a substrate between the first substrate holding device and the second substrate holding device; and first and second cleaning mechanisms that clean a lower surface of the substrate, wherein the first substrate holding device includes a suction holder that is configured to be rotatable about a vertical axis and sucks a center portion of the lower surface of the substrate, and a first rotation driver that rotates the suction holder, the first cleaning mechanism includes a first brush that cleans a peripheral portion of the lower surface of the substrate that is rotated while being held by the suction holder, the second substrate holding device includes a rotation member configured to be rotatable about the vertical axis, a second rotation driver that rotates the rotation member, and an abutment holder that holds the substrate by abutting against an outer peripheral end of the substrate that is arranged directly downward of the rotation member, and the second cleaning mechanism includes a second brush that cleans a region inward of the peripheral portion of the lower surface of the substrate that is rotated while being held by the abutment holder.