发明名称 Sub-lithographic patterning of magnetic tunneling junction devices
摘要 A method for fabricating a magnetic tunnel junction (MTJ) device includes creating a recess within a second patterning layer, in which a first patterning layer overhangs the recessed second patterning layer. Such a method further includes depositing a film into the recess to create a keyhole pattern within the deposited film. The method further includes transferring the keyhole pattern through a hard mask layer to an MTJ stack. The method also includes depositing a conductive material into the transferred keyhole pattern and on an MTJ stack. The method also includes removing the hard mask layer to create a conductive hard mask pillar.
申请公布号 US9490424(B2) 申请公布日期 2016.11.08
申请号 US201615149004 申请日期 2016.05.06
申请人 QUALCOMM INCORPORATED 发明人 Lu Yu
分类号 H01L43/00;H01L43/12;H01L27/22;H01L43/02;H01L43/08;G11C11/16;H01L43/10 主分类号 H01L43/00
代理机构 Seyfarth Shaw LLP 代理人 Seyfarth Shaw LLP
主权项 1. A method for fabricating a magnetic tunnel junction (MTJ) device, comprising: creating a recess within a second patterning layer, in which a first patterning layer overhangs the recessed second patterning layer; depositing a film into the recess to create a keyhole pattern within the deposited film; transferring the keyhole pattern through a hard mask layer to an MTJ stack; depositing a conductive material into the transferred keyhole pattern and on the MTJ stack; and removing the hard mask layer to create a conductive hard mask pillar.
地址 San Diego CA US