发明名称 Semiconductor devices with germanium-rich active layers and doped transition layers
摘要 Semiconductor device stacks and devices made there from having Ge-rich device layers. A Ge-rich device layer is disposed above a substrate, with a p-type doped Ge etch suppression layer (e.g., p-type SiGe) disposed there between to suppress etch of the Ge-rich device layer during removal of a sacrificial semiconductor layer richer in Si than the device layer. Rates of dissolution of Ge in wet etchants, such as aqueous hydroxide chemistries, may be dramatically decreased with the introduction of a buried p-type doped semiconductor layer into a semiconductor film stack, improving selectivity of etchant to the Ge-rich device layers.
申请公布号 US9490329(B2) 申请公布日期 2016.11.08
申请号 US201514756789 申请日期 2015.10.13
申请人 Intel Corporation 发明人 Rachmady Willy;Le Van H.;Pillarisetty Ravi;Kachian Jessica S.;French Marc C.;Budrevich Aaron A.
分类号 H01L31/0328;H01L31/0336;H01L31/072;H01L31/109;H01L29/167;H01L29/78;H01L29/66;H01L21/306;H01L29/06;H01L29/786;H01L29/36;H01L29/775;H01L29/778;H01L29/10;H01L29/161;H01L29/165;H01L29/423;H01L21/3065;B82Y10/00;B82Y40/00;H01L21/02 主分类号 H01L31/0328
代理机构 Blakely, Sokoloff, Taylor & Zafman LLP 代理人 Blakely, Sokoloff, Taylor & Zafman LLP
主权项 1. A semiconductor device, comprising: a germanium (Ge)-rich fin disposed above a substrate; a SiGe transition layer disposed above the substrate, and below the fin; and an n-type SiGe layer disposed above the substrate, and below the SiGe transition layer.
地址 Santa Clara CA US