Solid image pickup apparatus

摘要

A solid image pickup apparatus according to an embodiment includes: a device chip including a first principal surface and a second principal surface, a CMOS device and an electrode portion being formed on the first principal surface; a holding block including a joining surface joined to the second principal surface and an inclined surface inclined inward at a predetermined angle relative to the joining surface; a wiring board including a distal end portion including a connection portion connected to the electrode portion on the first principal surface, an extending portion that is in contact with the inclined surface, the extending portion being joined to the inclined surface via a bonding layer; and a flexure portion flexed at the predetermined angle between the distal end portion and the extending portion.

主权项

1. A solid image pickup apparatus comprising:
an image pickup device substrate including a first principal surface and a second principal surface, a solid image pickup device being formed on the first principal surface; a holding portion including a joining surface directly joined to the second principal surface of the image pickup device substrate, and an inclined surface inclined inward at a predetermined angle relative to the joining surface; and a wiring board including a distal end portion, an extending portion and a flexible portion disposed between the distal end portion and extending portion, the distal end portion being joined to the image pickup device substrate, the extending portion being jointed to the inclined surface of the holding portion via a bonding layer, and the flexure portion being flexed at the predetermined angle to permit the extending portion to be jointed to the inclined surface.