METHOD FOR MANUFACTURING WIRING BOARD

摘要

Disclosed is a method for efficiently manufacturing a wiring board using an insulating substrate 1 having a through hole 2. The method for manufacturing the wiring board is characterized in that: a seed layer 3 is formed on one surface of the insulating substrate 1; the surface having the seed layer 3 formed thereon is coated with a masking film 4; electroplating is performed by disposing the insulating substrate 1 and an anode 5 such that the anode 5 and the insulating substrate 1 surface on the reverse side of the surface having the seed layer 3 formed thereon face each other; and after forming a metal layer 8 in the through hole 2, the masking film 4 is removed.