| 摘要 |
PURPOSE:To prevent the vertical movement of a semiconductor chip mounted on a lead structure body, such as a film carrier, lead frame, etc., caused by the variation of fluidity balance of a resin when the semiconductor chip is sealed with the resin by transfer molding. CONSTITUTION:A film carrier 1, namely, a semiconductor chip 4 mounted on the carrier 1 is held at a fixed position by making mobile pins 17 and 18 movably fitted to a top force 11 and bottom force 12 freely forwards and backwards to advance into cavities 15 and 16 until the front ends of the pins 17 and 18 come into contact with the carrier 1. While the pins 17 and 18 are in contact with the carrier 1, a resin 20 is injected into the cavities 15 and 16 through gates 13 and 14 and the pins 17 and 18 are gradually moved backward in accordance with the injecting state of the resin 20. |
