| 摘要 |
PURPOSE: To enhance interfacial adhesion between a polymer and metal such as a lead frame or metal alloy. CONSTITUTION: The method for improving the adhesion of the polymers 17 and 19 to the lead frame 11 and such lead frame 11 are provided. The lead frame has a flag 14 having a top face 15, a base face 18 and a lead 12. Microscopic locking form parts are formed on the head face and the base face of the flag by giving shock to the flag by a gird material. Thus, the head and base faces are roughened. A semiconductor die 13 is fitted to the flag by a die attach material 17 and the flag, a semiconductor material and a part of the lead are filled with a molding material. A pit improves the adhesion of the die attach material and the molding material to the lead frame. |
